Invention Grant
- Patent Title: Copper-nickel alloy electroplating device
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Application No.: US15519474Application Date: 2015-06-25
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Publication No.: US10538854B2Publication Date: 2020-01-21
- Inventor: Hitoshi Sakurai , Kazunori Ono , Akira Hashimoto , Satoshi Yuasa
- Applicant: Dipsol Chemicals Co., LTD.
- Applicant Address: JP Tokyo
- Assignee: DIPSOL CHEMICALS CO., LTD.
- Current Assignee: DIPSOL CHEMICALS CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2014-212524 20141017
- International Application: PCT/JP2015/068332 WO 20150625
- International Announcement: WO2016/059833 WO 20160421
- Main IPC: C25D21/14
- IPC: C25D21/14 ; C25D3/58 ; C22C9/06 ; C22C19/00 ; C22C19/03 ; C25D3/56 ; C25D17/00 ; C25D21/12 ; C25D21/06 ; C25D21/10 ; C25D5/08

Abstract:
Provided is a copper-nickel alloy electroplating apparatus which is capable of stably forming a copper-nickel plated coating on a workpiece with a uniform composition and which enables a plating bath to be used for a long period. The present invention provides a copper-nickel alloy electroplating apparatus (1), comprising: a cathode chamber (4) in which a workpiece (5) is to be placed; an anode chamber (6); an anode (7) placed in the anode chamber; an electrically conductive diaphragm (14) placed to separate the cathode chamber and the anode chamber from each other; a cathode chamber oxidation-reduction potential adjusting tank (8) for adjusting the oxidation-reduction potential of a plating liquid in the cathode chamber; an anode chamber oxidation-reduction potential adjusting tank (10) for adjusting the oxidation-reduction potential of a plating liquid in the anode chamber; and a power supply unit (36) that provides an electric current to flow between the workpiece and the anode.
Public/Granted literature
- US20170241040A1 COPPER-NICKEL ALLOY ELECTROPLATING DEVICE Public/Granted day:2017-08-24
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