Invention Grant
- Patent Title: Arrangement and method for connecting an electrical component to a leadframe
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Application No.: US14878644Application Date: 2015-10-08
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Publication No.: US10539585B2Publication Date: 2020-01-21
- Inventor: Gaetan Vich
- Applicant: Continental Automotive Systems, Inc.
- Applicant Address: US MI Auburn Hills
- Assignee: Continental Automotive Systems, Inc.
- Current Assignee: Continental Automotive Systems, Inc.
- Current Assignee Address: US MI Auburn Hills
- Main IPC: G01P1/02
- IPC: G01P1/02 ; G01P3/42 ; H05K3/32 ; H01R4/28 ; H05K3/28
Abstract:
An automotive component assembly comprises an input circuit portion for a sensor and a component portion. The input circuit portion is aligned with the component portion in a desired assembly position. A pocket is at least partially defined by the component portion to receive the input circuit portion and a clamping force retains the input circuit portion between a first layer and a second layer of the component portion forming the pocket. An overmold material is applied to retain the input circuit portion and the component portion to one another.
Public/Granted literature
- US20160103147A1 ARRANGEMENT AND METHOD FOR CONNECTING AN ELECTRICAL COMPONENT TO A LEADFRAME Public/Granted day:2016-04-14
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