Invention Grant
- Patent Title: Binding processing device
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Application No.: US15786022Application Date: 2017-10-17
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Publication No.: US10539914B2Publication Date: 2020-01-21
- Inventor: Hiroaki Awano , Masashi Matsumoto , Takuya Makita , Katsumi Harada , Kojiro Tsutsumi , Toshiyasu Yukawa , Takashi Ogino
- Applicant: FUJI XEROX CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FUJI XEROX CO., LTD.
- Current Assignee: FUJI XEROX CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2017-076995 20170407; JP2017-076996 20170407; JP2017-076997 20170407
- Main IPC: B65H37/04
- IPC: B65H37/04 ; G03G15/00 ; B42B4/00 ; B42B5/00

Abstract:
A binding processing device includes: a needle binding unit that forms a needle binding portion that binds a paper bundle using a needle; a needleless binding unit that forms a needleless binding portion that binds the paper bundle without using a needle; and a plurality of exit rolls that exit the bound paper bundle. A distance between the needleless binding portion and a center of the plurality of exit rolls is equal to or longer than a distance between the needle binding portion and the center.
Public/Granted literature
- US20180292779A1 BINDING PROCESSING DEVICE Public/Granted day:2018-10-11
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