Invention Grant
- Patent Title: Stress testing a processor memory with a link stack
-
Application No.: US15804512Application Date: 2017-11-06
-
Publication No.: US10540249B2Publication Date: 2020-01-21
- Inventor: Manoj Dusanapudi , Shakti Kapoor
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Martin & Associates, LLC
- Agent Bret J. Petersen
- Main IPC: G06F11/00
- IPC: G06F11/00 ; G06F11/263

Abstract:
A processor memory is stress tested with a variable link stack depth using link stack test segments with non-naturally aligned data boundaries. Link stack test segments are interspersed into test code of a processor memory tests to change the link stack depth without changing results of the test code. The link stack test segments are the same structure as the segments of the test code and have non-naturally aligned boundaries. The link stack test segments include branch to target, push/pop, push and pop segments. The depth of the link stack is varied independent of the memory test code by changing the number to branches in the branch to target segment and varying the number of the push/pop segments.
Public/Granted literature
- US20180267876A1 STRESS TESTING A PROCESSOR MEMORY WITH A LINK STACK Public/Granted day:2018-09-20
Information query