Invention Grant
- Patent Title: System for manufacturing a semiconductor device
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Application No.: US16149572Application Date: 2018-10-02
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Publication No.: US10540475B2Publication Date: 2020-01-21
- Inventor: Chi-Wen Chang , Hui Yu Lee , Ya Yun Liu , Jui-Feng Kuan , Yi-Kan Cheng
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: G06F9/455
- IPC: G06F9/455 ; G06F17/50

Abstract:
A system including a memory; and a simulation tool connected to the memory. The simulation tool is configured to receive information related to a plurality of dies. The simulation tool is further configured to receive a plurality of input vectors. The simulation tool is further configured to determining a temperature profile for a first die of the plurality of dies. The simulation tool is further configured to simulate operation of a second die of the plurality of dies based on the determined temperature profile and the received plurality of input vectors.
Public/Granted literature
- US20190034578A1 SYSTEM FOR MANUFACTURING A SEMICONDUCTOR DEVICE Public/Granted day:2019-01-31
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