Invention Grant
- Patent Title: Compressing data points into polygons
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Application No.: US15993294Application Date: 2018-05-30
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Publication No.: US10540785B2Publication Date: 2020-01-21
- Inventor: Michael Ray Elgersma , Benjamin Mohr
- Applicant: Honeywell International Inc.
- Applicant Address: US NJ Morris Plains
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morris Plains
- Agency: Fogg & Powers LLC
- Main IPC: G06T9/00
- IPC: G06T9/00 ; G06T15/08

Abstract:
A method for compressing three-dimensional data points is disclosed. The method includes measuring a plurality of three-dimensional data points using one or more sensors communicatively coupled to the computing device, where each three-dimensional data point represents a point in a three-dimensional environment. The method also includes dividing the three-dimensional environment into a plurality of spatial cubes, wherein each three-dimensional data point is mapped to one spatial cube. The method also includes, for each spatial cube, converting the three-dimensional data points in the respective spatial cube to a two-dimensional plane based on a number of three-dimensional data points in the respective spatial cube. The method also includes, for each two-dimensional plane, determining polygon vertices of a planar polygon at points where an edge of an associated spatial cube intersects the respective two-dimensional plane. The method also includes sending the polygon vertices of each planar polygon to a ground station.
Public/Granted literature
- US20190371007A1 COMPRESSING DATA POINTS INTO POLYGONS Public/Granted day:2019-12-05
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