Invention Grant
- Patent Title: Transient liquid phase material bonding and sealing structures and methods of forming same
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Application No.: US15371312Application Date: 2016-12-07
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Publication No.: US10541152B2Publication Date: 2020-01-21
- Inventor: Bradley Paul Barber
- Applicant: SKYWORKS SOLUTIONS, INC.
- Applicant Address: US MA Woburn
- Assignee: SKYWORKS SOLUTIONS, INC.
- Current Assignee: SKYWORKS SOLUTIONS, INC.
- Current Assignee Address: US MA Woburn
- Agency: Lando & Anastasi, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/48 ; H01Q1/48 ; H01Q1/38 ; H05K1/18 ; H01L23/66 ; H01L23/10
Abstract:
A bonding element includes a first transient liquid phase (TLP) bonding element including a first material and a second material, the first material having a higher melting point than the second material, a ratio of a quantity of the first material and the second material in the first TLP bonding element having a first value and a second TLP bonding element including the first material and the second material, a ratio of a quantity of the first material and the second material in the second TLP bonding element having a second value different from the first value.
Public/Granted literature
- US20170086320A1 TRANSIENT LIQUID PHASE MATERIAL BONDING AND SEALING STRUCTURES AND METHODS OF FORMING SAME Public/Granted day:2017-03-23
Information query
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