Invention Grant
- Patent Title: Substrate case and substrate accommodation apparatus
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Application No.: US12976149Application Date: 2010-12-22
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Publication No.: US10541160B2Publication Date: 2020-01-21
- Inventor: Hideo Mizutani , Tohru Kiuchi , Toru Kawaguchi , Takashi Masukawa
- Applicant: Hideo Mizutani , Tohru Kiuchi , Toru Kawaguchi , Takashi Masukawa
- Applicant Address: JP Tokyo
- Assignee: Nikon Corporation
- Current Assignee: Nikon Corporation
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Main IPC: B65H19/22
- IPC: B65H19/22 ; H01L21/67 ; B65H75/28 ; H01L21/673
Abstract:
A substrate case includes a shaft portion around which a sheet-shaped substrate having a circuit area in which a circuit manufacturing process is performed is wound; and a cover portion that accommodates the substrate in the state of being wound around the shaft portion, the shaft portion having a holding portion that holds an area different from the circuit area at a winding start portion of the substrate.
Public/Granted literature
- US20110155838A1 SUBSTRATE CASE AND SUBSTRATE ACCOMMODATION APPARATUS Public/Granted day:2011-06-30
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