Invention Grant
- Patent Title: Substrate processing method and substrate processing apparatus
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Application No.: US15109576Application Date: 2015-01-07
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Publication No.: US10541163B2Publication Date: 2020-01-21
- Inventor: Masahiro Yamamoto
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Ostrolenk Faber LLP
- Priority: JP2014-007398 20140120
- International Application: PCT/JP2015/050246 WO 20150107
- International Announcement: WO2015/107955 WO 20150723
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B08B1/00 ; B08B3/04 ; B08B9/093 ; H01L21/02 ; H01L21/687

Abstract:
A technique to prevent reduction in throughput of a substrate processing apparatus. On the occurrence of an event disabling execution of a recipe by a processing unit, a different recipe executed by this processing unit may be used depending on the type of event having occurred. The type of event to occur and a substitute recipe that can take the place of a recipe being executed are associated in advance. On the occurrence of abnormality, it is determined whether or not a recipe being executed can be substituted by a different recipe. If the recipe can be substituted, it is determined whether or not the substitute recipe is contained in an unfinished job. If these conditions are satisfied, a substrate processing schedule is changed to execute the substitute recipe in this processing unit. If these conditions are not satisfied, substrate process in this processing unit is stopped.
Public/Granted literature
- US20160329224A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2016-11-10
Information query
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