Invention Grant
- Patent Title: Power module and manufacturing method thereof
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Application No.: US15700662Application Date: 2017-09-11
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Publication No.: US10541188B2Publication Date: 2020-01-21
- Inventor: Michiaki Hiyoshi
- Applicant: Hyundai Motor Company , Kia Motors Corporation
- Applicant Address: KR Seoul KR Seoul
- Assignee: Hyundai Motor Company,Kia Motors Corporation
- Current Assignee: Hyundai Motor Company,Kia Motors Corporation
- Current Assignee Address: KR Seoul KR Seoul
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless
- Priority: KR10-2016-0120261 20160920
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/373 ; B23K26/211 ; H01L21/48 ; H01L23/00
Abstract:
A power module includes: a substrate; a power conversion chip disposed on one surface of the substrate; and a radiation member bonded to another surface of the substrate. The radiation member has a contact surface configured to come into contact with the other surface of the substrate, and includes a fused area within the contact surface so as to be fused to the other surface of the substrate.
Public/Granted literature
- US20180082920A1 POWER MODULE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-03-22
Information query
IPC分类:
