Invention Grant
- Patent Title: Semiconductor package with interconnected leads
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Application No.: US15934516Application Date: 2018-03-23
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Publication No.: US10541194B2Publication Date: 2020-01-21
- Inventor: Jeffrey Gail Holloway , Andy Quang Tran
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/057
- IPC: H01L23/057 ; H01L23/498 ; H01L23/31 ; H01L23/495 ; H01L21/48
Abstract:
A semiconductor package includes a semiconductor die and a ceramic package body covering the semiconductor die. The ceramic package body includes a plurality of contact pads. Each of a first plurality of leads includes a top portion and a bottom portion. The top portion of each of the first plurality of leads is electrically connected to a contact pad of the plurality of contact pads. Each of a second plurality of leads includes a top portion and a bottom portion and an interconnection portion between the top portion and the bottom portion. The top portion of each of the second plurality of leads includes separate finger portions that are electrically connected to at least two of the plurality of contact pads.
Public/Granted literature
- US20180277465A1 SEMICONDUCTOR PACKAGE WITH INTERCONNECTED LEADS Public/Granted day:2018-09-27
Information query
IPC分类:
