An alloy liner is located on a diffusion barrier liner and both are present in at least a via portion of a combined via/line opening that is present in an interconnect dielectric material. The alloy liner includes an alloy of a first metal or metal alloy having a first bulk resistivity and a second metal or metal alloy having a second bulk resistivity that is higher than the first bulk resistivity. A first electrically conductive structure is located on the alloy liner and is present in at least the via portion of the combined via/line opening. The first electrically conductive structure includes the second metal or metal alloy. A second electrically conductive structure can be present in at least the line portion of the combined via/line opening. The second electrically conductive structure may include a metal or metal alloy having the first or second bulk resistivity.