Invention Grant
- Patent Title: SiC-based superjunction semiconductor device
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Application No.: US15854341Application Date: 2017-12-26
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Publication No.: US10541301B2Publication Date: 2020-01-21
- Inventor: Hans-Joachim Schulze , Wolfgang Jantscher , Roland Rupp , Werner Schustereder , Hans Weber
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102015202121 20150206
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/04 ; H01L21/266 ; H01L21/265 ; H01L29/16 ; H01L29/20

Abstract:
A method of producing a semiconductor device includes providing a semiconductor body including a semiconductor body material having a dopant diffusion coefficient that is smaller than the corresponding dopant diffusion coefficient of silicon. At least one first semiconductor region doped with dopants of a first conductivity type is produced in the semiconductor body, including by applying a first implantation of first implantation ions. At least one second semiconductor region adjacent to the at least one first semiconductor region and doped with dopants of a second conductivity type complementary to the first conductivity type is produced in the semiconductor body, including by applying a second implantation of second implantation ions.
Public/Granted literature
- US20180138266A1 SiC-Based Superjunction Semiconductor Device Public/Granted day:2018-05-17
Information query
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