Invention Grant
- Patent Title: Printed circuit board with routing of a conductor and dielectric strands
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Application No.: US16130933Application Date: 2018-09-13
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Publication No.: US10542618B1Publication Date: 2020-01-21
- Inventor: Yanyan Zhang , Lloyd Andre Walls , Jinwoo Choi , Mehdi Mohamed Mechaik
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Lieberman & Brandsdorfer, LLC
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/03 ; H01B3/08

Abstract:
Embodiments are directed to a printed circuit board and a method of manufacturing the printed circuit board. The PCB is a multi-layer component, including a dielectric material, an intermediate layer positioned adjacent to the dielectric material, and a conductor positioned adjacent to the intermediate layer. The intermediate layer is comprised of fiberglass strands having an associated orientation. When assembled, the fiberglass of the intermediate layer and the conductor having a matching orientation and separation distance from a source to a destination.
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