Invention Grant
- Patent Title: 3D printed sensor and cushioning material
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Application No.: US16401469Application Date: 2019-05-02
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Publication No.: US10542624B2Publication Date: 2020-01-21
- Inventor: Todd Sean Harple , Francis Anthony Bitonti , Peter Emery Wildfeuer
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Hanley, Flight and Zimmerman, LLC
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/03 ; H05K3/12 ; H05K1/16 ; B33Y10/00 ; B33Y80/00

Abstract:
Methods, apparatus, systems and articles of manufacture are disclosed relating to 3D-printed structures. An example method of building a sensor with a 3D printer includes building a first conductive substrate and building a second conductive substrate. The example method also includes building a dielectric structure between the first conductive substrate and the second conductive substrate, the dielectric structure including a first latticed structure including a first plurality of legs extending inwardly at a first angle and a second latticed structure including a second plurality of legs extending inwardly at a second angle.
Public/Granted literature
- US20190261510A1 3D PRINTED SENSOR AND CUSHIONING MATERIAL Public/Granted day:2019-08-22
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