Invention Grant
- Patent Title: Apparatus and method to electrostatically chuck substrates to a moving carrier
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Application No.: US15553676Application Date: 2016-02-23
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Publication No.: US10546768B2Publication Date: 2020-01-28
- Inventor: Daniel Robert Boughton , James Gerard Fagan , Valerie Elise Mebert
- Applicant: CORNING INCORPORATED
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- International Application: PCT/US2016/019086 WO 20160223
- International Announcement: WO2016/137964 WO 20160901
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/68 ; H01L21/02
Abstract:
An electrostatic chucking apparatus includes a movable member arranged for movement relative to an axial axis, at least one electrostatic chuck coupled to the movable member, and a stationary member. At least one moving insulated electrode is coupled to the movable member, and at least one stationary insulated electrode is coupled to the stationary member in an axial position corresponding to the at least one moving insulated electrode. A slip ring contact couples electrical energy from the at least one stationary insulated electrode to the at least one moving insulated electrode.
Public/Granted literature
- US20180053677A1 APPARATUS AND METHOD TO ELECTROSTATICALLY CHUCK SUBSTRATES TO A MOVING CARRIER Public/Granted day:2018-02-22
Information query
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