Invention Grant
- Patent Title: Method of forming a plurality of electronic component packages
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Application No.: US15634861Application Date: 2017-06-27
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Publication No.: US10546833B2Publication Date: 2020-01-28
- Inventor: Brett Arnold Dunlap
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/48 ; H01L21/56 ; H01L21/78

Abstract:
A method of forming a plurality of electronic component packages includes attaching electronic components to a carrier, wherein high aspect ratio spaces exist between the electronic components. A dielectric sheet is laminated around the electronic components thus filling the spaces and forming a package body. The spaces are completely and reliably filled by the dielectric sheet and thus the package body has an absence of voids. Further, an upper surface of the package body is planar, i.e., has an absence of ripples or other non-uniformities. Further, lamination of the dielectric sheet is performed with a low cost lamination system.
Public/Granted literature
- US20170294405A1 METHOD OF FORMING A PLURALITY OF ELECTRONIC COMPONENT PACKAGES Public/Granted day:2017-10-12
Information query
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