An electrical connector is electrically connected to a chip module having multiple contact pads. The electrical connector includes an insulating body having multiple accommodating grooves. Multiple conductive terminals are respectively accommodated in the accommodating grooves. Each conductive terminal has a main body portion accommodated in a corresponding accommodating groove and an extending arm extending forward from an upper end of the main body portion. Each extending arm of the conductive terminals is used to be upward electrically connected to a corresponding contact pad. At least one supporting portion is provided on the insulating body and located at one side of a corresponding accommodating groove. A first guide portion protrudes and extends from a top end of the supporting portion to upward abut the chip module. A horizontal projection of the extending arm of at least one conductive terminal partially overlaps with a horizontal projection of the first guide portion.