- Patent Title: Bulk acoustic wave resonator and method of manufacturing the same
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Application No.: US15809696Application Date: 2017-11-10
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Publication No.: US10547285B2Publication Date: 2020-01-28
- Inventor: Chang Hyun Lim , Yoon Sok Park , Jong Woon Kim , Tae Yoon Kim , Moon Chul Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2017-0050608 20170419
- Main IPC: H03H9/17
- IPC: H03H9/17 ; H03H9/05 ; H03H9/02 ; H03H3/02

Abstract:
A bulk acoustic wave resonator includes a substrate including a cavity groove, a membrane layer disposed above the substrate and including a convex portion. And a lower electrode including a portion thereof disposed on the convex portion. The bulk acoustic wave resonator also includes a piezoelectric layer configured so that a portion of the piezoelectric layer is disposed above the convex portion, and an upper electrode disposed on the piezoelectric layer. A first space formed by the cavity groove and a second space formed by the convex portion form a cavity, the cavity groove is disposed below an active region, and the convex portion comprises an inclined surface disposed outside of the cavity groove.
Public/Granted literature
- US20180309428A1 BULK ACOUSTIC WAVE RESONATOR AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-10-25
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