A multilayer printed wiring board including insulating layers, ground layers thereon, and at least one via hole. The ground layers include a wiring layer and a first impedance adjustment layer. The wiring layer includes a solid conductor and a conductive line. The conductive line is disposed inside an opening and a passage of the solid conductor. The first impedance adjustment layer includes a solid conductor having an opening. The via hole is located inside the openings of the wiring layer and the first impedance adjustment layer and is connected to the conductive line. A first distance is smaller than a second distance, where the first distance is a distance from an outline of the opening of the wiring layer to the via hole, and the second distance is a distance from an outline of the opening of the first impedance adjustment layer to the via hole.