Invention Grant
- Patent Title: Current redistribution in a printed circuit board
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Application No.: US15258472Application Date: 2016-09-07
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Publication No.: US10548227B2Publication Date: 2020-01-28
- Inventor: Goutham Sabavat , Javid Mohamed , Subramanian Ramanathan , Stephen Scearce
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H05K3/22 ; H05K1/02

Abstract:
In one implementation, a multilayered printed circuit board is configured to redirect current distribution. The current may be distributed by steering, blocking, or otherwise manipulating current flows. The multilayered printed circuit board includes at least one power plane layer. The power plane layer does not distribute current evenly. Instead, the power plane layer includes multiple patterns with different resistances. The patterns may include a hatching pattern, a grid pattern, a directional pattern, a slot, a void, or a continuous pattern. The pattern is a predetermined spatial variation such that current flows in a first area differently than current flows in a second area.
Public/Granted literature
- US20160381807A1 Current Redistribution in a Printed Circuit Board Public/Granted day:2016-12-29
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