Invention Grant
- Patent Title: Device for manufacturing coil spring and method for manufacturing coil spring
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Application No.: US15688570Application Date: 2017-08-28
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Publication No.: US10549334B2Publication Date: 2020-02-04
- Inventor: Yuu Ichitsuka , Yuji Mori
- Applicant: NHK SPRING CO., LTD.
- Applicant Address: JP Yokohama-Shi
- Assignee: NHK SPRING CO., LTD.
- Current Assignee: NHK SPRING CO., LTD.
- Current Assignee Address: JP Yokohama-Shi
- Agency: Holtz, Holtz & Volek PC
- Priority: JP2015-038709 20150227
- Main IPC: B21F3/04
- IPC: B21F3/04 ; B21F35/00 ; F16F1/04

Abstract:
A coil spring manufacturing device includes a mandrel around which a wire is wound, a feed mechanism which feeds the wire toward the mandrel, guide members which guide the wire, a chuck which fixes a distal end of the wire, and a clamp mechanism. The clamp mechanism sandwiches the wire from both sides before the distal end of the wire reaches the mandrel. Further, the clamp mechanism can be rotated about a fulcrum by rotation actuator, and can also be slid in a direction along an axis of the mandrel by sliding actuator. In a state in which the wire is sandwiched by the clamp mechanism, the clamp mechanism is rotated, and if necessary, is slid. Thereby, a bent portion for a negative pitch portion of a coil spring is formed at a part of the wire.
Public/Granted literature
- US20170355011A1 DEVICE FOR MANUFACTURING COIL SPRING AND METHOD FOR MANUFACTURING COIL SPRING Public/Granted day:2017-12-14
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