Invention Grant
- Patent Title: Laser-assisted micromachining systems and methods
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Application No.: US15584140Application Date: 2017-05-02
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Publication No.: US10549382B2Publication Date: 2020-02-04
- Inventor: Yung C. Shin , Xiangyang Dong
- Applicant: Purdue Research Foundation
- Applicant Address: US IN West Lafayette
- Assignee: Purdue Research Foundation
- Current Assignee: Purdue Research Foundation
- Current Assignee Address: US IN West Lafayette
- Agency: Hartman Global IP Law
- Agent Gary M. Hartman; Domenica N. S. Hartman
- Main IPC: B23K26/06
- IPC: B23K26/06 ; B23K26/02 ; B23K26/00 ; B23P25/00 ; B23K26/36

Abstract:
Laser-assisted micromachining methods and systems capable of providing flexible beam positioning and low incident angles. Such laser-assisted micromachining systems preferably include a laser beam source, a cutting tool, means for engaging a workpiece with the cutting tool, optical elements arranged to define a path of a laser beam emitted by the laser beam source wherein the optical elements include at least a first mirror mounted in fixed relation to the laser beam source, and means for adjustably mounting a second mirror to project the laser beam onto the workpiece in proximity to the cutting tool and at an incidence angle relative to a surface of the workpiece.
Public/Granted literature
- US20170320164A1 LASER-ASSISTED MICROMACHINING SYSTEMS AND METHODS Public/Granted day:2017-11-09
Information query
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