Invention Grant
- Patent Title: Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate
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Application No.: US14401233Application Date: 2013-03-26
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Publication No.: US10549399B2Publication Date: 2020-02-04
- Inventor: Tomohiro Iwano , Hisataka Minami , Toshiaki Akutsu , Koji Fujisaki
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMCIAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMCIAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery, L.L.P.
- Priority: JP2012-116865 20120522
- International Application: PCT/JP2013/058770 WO 20130326
- International Announcement: WO2013/175854 WO 20131128
- Main IPC: C09K3/14
- IPC: C09K3/14 ; C09G1/02 ; B24B37/04 ; C01B33/12 ; H01L21/304 ; H01L21/3105
Abstract:
A polishing liquid comprising an abrasive grain, an additive, and water, wherein the abrasive grain includes a hydroxide of a tetravalent metal element, and produces absorbance of 1.00 or more and less than 1.50 for light having a wavelength of 400 nm in an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass %.
Public/Granted literature
- US20150139885A1 SLURRY, POLISHING-SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLISHING METHOD, AND SUBSTRATE Public/Granted day:2015-05-21
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