A package substrate cutting jig table for use in cutting a package substrate is provided. The jig table includes a jig base and a holding member adapted to be detachably mounted on the jig base. The holding member includes a holding surface for holding the package substrate, a plurality of escape grooves formed on the holding surface for preventing the interference of a cutting blade with the holding member, the escape grooves corresponding to a plurality of division lines formed on the package substrate, and a plurality of suction holes formed in a plurality of separate regions defined by the escape grooves on the holding surface. The holding member is formed of a material having a dynamic viscoelastic modulus ranging from 0.16 to 0.41.