Invention Grant
- Patent Title: Thinwall composites for electronic enclosures and other devices
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Application No.: US15324436Application Date: 2015-07-09
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Publication No.: US10549512B2Publication Date: 2020-02-04
- Inventor: Scott Michael Davis , Daniel Sowle , Craig Lawrence Milne , Christopher Wall , Emile Homsi
- Applicant: SABIC Global Technologies B.V.
- Applicant Address: NL Bergen op Zoom
- Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
- Current Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
- Current Assignee Address: NL Bergen op Zoom
- Agency: Cantor Colburn LLP
- International Application: PCT/IB2015/055211 WO 20150709
- International Announcement: WO2016/005942 WO 20160114
- Main IPC: B32B27/12
- IPC: B32B27/12 ; B29C45/14 ; B32B1/02 ; B32B5/02 ; B32B7/02 ; G06F1/16 ; B29K69/00 ; B29K309/08 ; B29L31/34

Abstract:
In an embodiment, an A-B-A structure, can comprise: a core layer comprising a first thermoplastic material having a first density (Y), wherein the core layer has a core thickness and wherein the core layer comprise at least one of (i) a through plane thermal conductivity of greater than equal to 0.1 W/m K, and (ii) a core layer density (X) that is X≥0.8Y; a first outer layer comprising a second thermoplastic material located on a first side of the core layer; and a second outer layer comprising the second thermoplastic material located on a second side of the core layer opposite the first side; wherein the core thickness is 30% to 75% of a total thickness of the A-B-A structure.
Public/Granted literature
- US20170203551A1 THINWALL COMPOSITES FOR ELECTRONIC ENCLOSURES AND OTHER DEVICES Public/Granted day:2017-07-20
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