Invention Grant
- Patent Title: Off-set resin formulations and blocking/deblocking resin systems for use as a “co-cure-ply” in the fabrication of large-scale composite structure
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Application No.: US15699433Application Date: 2017-09-08
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Publication No.: US10549516B2Publication Date: 2020-02-04
- Inventor: Frank L. Palmieri , John W. Connell , Christopher J. Wohl, Jr.
- Applicant: United States of America as represented by the Administrator of NASA
- Applicant Address: US DC Washington
- Assignee: UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF NASA
- Current Assignee: UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF NASA
- Current Assignee Address: US DC Washington
- Agent Jennifer L. Riley; Robin W. Edwards
- Main IPC: B32B27/38
- IPC: B32B27/38 ; B32B27/34 ; B32B37/14 ; B32B5/02 ; B32B5/26 ; B32B27/08 ; B32B27/12 ; B32B27/18 ; B32B27/20 ; B32B27/26 ; B32B27/28 ; B32B27/36 ; B32B27/40 ; B32B27/42 ; B29C65/00 ; B29C65/48 ; B29C65/50 ; B32B7/12 ; B29C70/30 ; B29C65/02 ; C09J5/06 ; B29C65/14

Abstract:
A method for bonding composite substrates includes coupling a first co-cure prepreg layer having a first off-set amine to epoxide molar ratio onto a surface of a first composite substrate and coupling a second co-cure prepreg layer having a second off-set amine to epoxide molar ratio onto a surface of a second composite substrate. The first and second composite substrates are cured to the first and second co-cure prepreg layers, respectively, using a first cure cycle (including B-stage and cure temperatures) to form a first and a second co-cure prepreg layer portion. The method further includes coupling the first co-cure prepreg layer portion to the second co-cure prepreg layer portion and applying a second cure cycle to cure the first co-cure prepreg layer portion of the first composite substrate to the second co-cure prepreg layer portion of the second composite substrate to form a monolithic covalently bonded composite structure.
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