Invention Grant
- Patent Title: Head unit and liquid ejection apparatus
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Application No.: US15939437Application Date: 2018-03-29
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Publication No.: US10549535B2Publication Date: 2020-02-04
- Inventor: Shogo Mori , Motohiro Tsuboi
- Applicant: BROTHER KOGYO KABUSHIKI KAISHA
- Applicant Address: JP Nagoya-Shi, Aichi-Ken
- Assignee: BROTHER KOGYO KABUSHIKI KAISHA
- Current Assignee: BROTHER KOGYO KABUSHIKI KAISHA
- Current Assignee Address: JP Nagoya-Shi, Aichi-Ken
- Agency: Merchant & Gould P.C.
- Priority: JP2017-192089 20170929
- Main IPC: B41J2/14
- IPC: B41J2/14 ; H05K1/02

Abstract:
A head unit includes a circuit board, a casing, and a head module including: a nozzle plate and a liquid-passage defining member stacked on each other in a stacking direction; a drive element; and an interconnect member. A distance between a first end and a second end of the nozzle plate which are spaced in a first direction is greater than a distance between a third end and a fourth end of the nozzle plate which are spaced in a second direction. A distance between a seventh end and an eighth end of the circuit board which are spaced in the stacking direction is greater than a distance between a fifth end and a sixth end of the circuit board which are spaced in the first direction.
Public/Granted literature
- US20190100005A1 HEAD UNIT AND LIQUID EJECTION APPARATUS Public/Granted day:2019-04-04
Information query
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