- Patent Title: Bend-open package and method for manufacturing bend-open package
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Application No.: US15933908Application Date: 2018-03-23
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Publication No.: US10549873B2Publication Date: 2020-02-04
- Inventor: Tadashi Hashimoto , Hisashi Hashimoto
- Applicant: FUTURE LABO CO., LTD.
- Applicant Address: JP Shiga
- Assignee: FUTURE LABO CO, LTD.
- Current Assignee: FUTURE LABO CO, LTD.
- Current Assignee Address: JP Shiga
- Agency: Nakanishi IP Associates, LLC
- Priority: JP2016-153068 20160803; JP2016-205845 20161020; JP2017-071887 20170331
- Main IPC: B65B47/04
- IPC: B65B47/04 ; B65B61/18 ; B65D83/00 ; B65B9/04

Abstract:
A bend-open package includes a sealant without unsealing an opening until the package is bent to a predetermined bend angle or less to prevent leakage of the content in a package body. A method for manufacturing the bend-open package includes preparing a sheet member for a bend-open package, including in sequence, (a) forming cuts in the surface of a sheet base, and (b) press-bonding sealants press-cut from a sealant base to the surface of the sheet base to cover the cuts. The steps include embedding a periphery of the sealant in the surface of the sheet member by a predetermined depth, and forming a protrusion having a height smaller than a thickness of the sealant protruding outwardly from the surface of the sheet member along the entire periphery of the sealant.
Public/Granted literature
- US20180208344A1 BEND-OPEN PACKAGE AND METHOD FOR MANUFACTURING BEND-OPEN PACKAGE Public/Granted day:2018-07-26
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