Invention Grant
- Patent Title: Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board
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Application No.: US15521062Application Date: 2015-11-04
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Publication No.: US10550244B2Publication Date: 2020-02-04
- Inventor: Takashi Kobayashi , Kentaro Takano , Sotaro Hiramatsu
- Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2014-226052 20141106
- International Application: PCT/JP2015/080986 WO 20151104
- International Announcement: WO2016/072404 WO 20160512
- Main IPC: C08K5/315
- IPC: C08K5/315 ; C08J5/24 ; C08K5/3415 ; C08K3/36 ; H05K1/03 ; C08L79/04 ; C08G59/40 ; C08L79/08 ; C08G73/06 ; C08L63/00 ; H01L23/29 ; H05K3/46
Abstract:
A resin composition comprising one or more cyanate compounds (A) selected from a group consisting of a naphthol aralkyl-based cyanate compound, a naphthylene ether-based cyanate compound, a xylene resin-based cyanate compound, a trisphenolmethane-based cyanate compound, and an adamantane skeleton-based cyanate compound; a polymaleimide compound (B) represented by general formula (1); and a filler (C).
Public/Granted literature
- US20170313854A1 RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, AND PRINTED WIRING BOARD Public/Granted day:2017-11-02
Information query
