Invention Grant
- Patent Title: Polymer compound, surface treatment agent, laminated body using surface treatment agent, transistor, method for manufacturing laminated body
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Application No.: US15659838Application Date: 2017-07-26
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Publication No.: US10550281B2Publication Date: 2020-02-04
- Inventor: Yusuke Kawakami , Shohei Koizumi , Takashi Sugizaki
- Applicant: NIKON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: NIKON CORPORATION
- Current Assignee: NIKON CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2015-81164 20150410
- Main IPC: C09D133/14
- IPC: C09D133/14 ; C08F20/36 ; C23C18/20 ; C08F20/06 ; H05K3/18 ; H05K3/38
Abstract:
Provided is a compound which is excellent terms of stability and tight adhesion to substrates and on which wiring can be formed by electroless plating. The compound is a high-molecular-weight compound having a constituent unit represented by the following formula (1). [In formula (1), R1 represents a hydrogen atom or a methyl group, m is an integer of 2-20, and Q represents a photosensitive leaving group].
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