Invention Grant
- Patent Title: Solvent-free silicone-modified polyimide resin composition
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Application No.: US16060161Application Date: 2016-12-13
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Publication No.: US10550287B2Publication Date: 2020-02-04
- Inventor: Hatsuhiko Hattori , Yoshinori Yoneda
- Applicant: SHIN-ETSU CHEMICAL CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2015-252901 20151225
- International Application: PCT/JP2016/087012 WO 20161213
- International Announcement: WO2017/110576 WO 20170629
- Main IPC: C09D183/10
- IPC: C09D183/10 ; C09D7/62 ; C09D4/06 ; C09D133/06 ; C09J4/06 ; C09J11/04 ; C09J133/06 ; C09J183/10

Abstract:
A solvent-free silicone-modified polyimide resin composition having fluidity and including no solvent, the composition containing(A) a silicone-modified polyimide resin of formula (1), Ee-Ff-Gg (1) (E is formula (2), F is formula (3), and G is a diamine-derived divalent residue; f+e+g=100 mol %, the molar ratio of f/(e+g) is 0.8-1.2) (RA is a divalent hydrocarbon group, R1-R4 are monovalent hydrocarbon groups, R5 and R6 are an alkyl group, aryl group, or aralkyl group; m, n, and o are 0-20, n+o≥1, m+n+o=1-60) -Im-X-Im- (3) (Im is a cyclic group including a cyclic imide structure, X is a single bond, oxygen, sulfur, sulfide group, sulfone group, carbonyl group, —NRN—, —CRB2—, RArh—, —RArh(ORAr)i—, alkylene group, trivalent group having one H eliminated from said group, or arylene-alkylene group), (B) a polymerizable compound, (C) a polymerization initiator, and (D) hydrophobic fumed silica. This composition has excellent handleability due to its fluidity and thixotropy.
Public/Granted literature
- US20180312723A1 SOLVENT-FREE SILICONE-MODIFIED POLYIMIDE RESIN COMPOSITION Public/Granted day:2018-11-01
Information query
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