Invention Grant
- Patent Title: Thermally conductive sheet
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Application No.: US14770794Application Date: 2014-03-26
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Publication No.: US10550296B2Publication Date: 2020-02-04
- Inventor: Junichiro Sugita
- Applicant: DEXERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DEXERIALS CORPORATION
- Current Assignee: DEXERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Priority: JP2013-068724 20130328
- International Application: PCT/JP2014/058625 WO 20140326
- International Announcement: WO2014/157378 WO 20141002
- Main IPC: C09J133/08
- IPC: C09J133/08 ; C09J9/00 ; C09J11/04 ; C09J11/06 ; C09J7/22 ; C09J7/30 ; C09J7/38 ; C09J4/00 ; C09K5/14 ; C08K3/013 ; C08K3/20 ; C08K3/22 ; C08K3/28 ; C08K3/34 ; C08K3/38 ; C08K3/04 ; B32B27/30 ; B32B27/40 ; B32B27/08 ; B32B27/36 ; B32B7/12 ; B32B27/22 ; C08K5/11 ; H01L21/683 ; H01L23/373 ; C08K3/08 ; C08F220/18

Abstract:
A thermally conductive sheet in which an adhesive thermally conductive layer and a non-adhesive resin layer are stacked. The adhesive thermally conductive layer includes an acrylic resin formed by curing an acrylic compound and a thermally conductive filler, a glass transition temperature of the acrylic resin is from −80 to 15° C., a tack property of the adhesive thermally conductive layer is higher than a tack property of the non-adhesive resin layer, the tack property of the non-adhesive resin layer is from 6 to 30 kN/m2. The non-adhesive resin layer has a glass transition temperature from 60 to 110° C. The tack property is measured by pressing probe on a layer and peeling the probe under conditions of pressing speed of 30 mm/min, peeling speed of 120 mm/min, load of 196 g, pressing time of 5.0 sec, pulling distance of 5 mm, probe heating of 40° C. and sheet stage heating of 40° C.
Public/Granted literature
- US20160009963A1 THERMALLY CONDUCTIVE SHEET Public/Granted day:2016-01-14
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