Invention Grant
- Patent Title: Deformation rejection mechanism for offset minimization of out-of-plane sensing MEMS device
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Application No.: US15963257Application Date: 2018-04-26
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Publication No.: US10551191B2Publication Date: 2020-02-04
- Inventor: Giacomo Laghi , Luca Coronato , Jaakko Ruohio , Roberto Martini
- Applicant: INVENSENSE, INC.
- Applicant Address: US CA San Jose
- Assignee: INVENSENSE, INC.
- Current Assignee: INVENSENSE, INC.
- Current Assignee Address: US CA San Jose
- Agency: Haley Guiliano LLP
- Agent Joshua Van Hoven; Maryam Imam
- Main IPC: G01C19/5712
- IPC: G01C19/5712 ; G01C19/5747

Abstract:
An exemplary sensor may include a MEMS layer anchored to a cap and a substrate by anchoring portions of the MEMS layer. A suspended spring-mass system may include springs, at least one rigid mass, and at least one movable mass. The anchoring springs may be torsionally compliant about one or more axes and coupled to the rigid mass such that forces imparted by the anchoring portions are not transmitted to the movable mass.
Public/Granted literature
- US20180245920A1 DEFORMATION REJECTION MECHANISM FOR OFFSET MINIMIZATION OF OUT-OF-PLANE SENSING MEMS DEVICE Public/Granted day:2018-08-30
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