Invention Grant
- Patent Title: MEMS pressure sensing element
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Application No.: US15559647Application Date: 2015-12-10
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Publication No.: US10551263B2Publication Date: 2020-02-04
- Inventor: Guoguang Zheng
- Applicant: GOERTEK. INC
- Applicant Address: CN Weifang, Shandong
- Assignee: GOERTEK. INC
- Current Assignee: GOERTEK. INC
- Current Assignee Address: CN Weifang, Shandong
- Priority: CN201510368749 20150629
- International Application: PCT/CN2015/096919 WO 20151210
- International Announcement: WO2017/000501 WO 20170105
- Main IPC: B81B7/00
- IPC: B81B7/00 ; G01L9/00 ; G01L9/12 ; G01L19/06 ; B81C1/00

Abstract:
The present invention discloses an MEMS pressure sensing element, including a substrate provided with a groove; a pressure-sensitive film disposed above the substrate, the pressure-sensitive film sealing an opening of the groove to form a sealed cavity; and a movable electrode plate and a fixed electrode plate which are located in the sealed cavity and form a capacitor structure, wherein the fixed electrode plate is fixed on a bottom wall of the groove of the substrate, and the movable electrode plate is suspended above the fixed electrode plate and opposite to the fixed electrode plate; and the pressure-sensitive film is connected to the movable electrode plate so as to drive the movable electrode plate to move under the action of an external pressure. According to the MEMS pressure sensing element, pressure sensitivity and electrical detection are separated, the pressure-sensitive film is exposed in air, the capacitor structures are disposed in the sealed cavity defined by the pressure-sensitive film and the substrate, and the movable electrode plates of the capacitor structures can be driven by the pressure-sensitive film. In this way, not only is a pressure-sensitive function finished, but also external electromagnetic interferences on the capacitor structures are shielded.
Public/Granted literature
- US20180335358A1 MEMS PRESSURE SENSING ELEMENT Public/Granted day:2018-11-22
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