Invention Grant
- Patent Title: Light modules and devices incorporating light modules
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Application No.: US16216112Application Date: 2018-12-11
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Publication No.: US10551542B1Publication Date: 2020-02-04
- Inventor: Qing Tan , Mario Paniccia , Tim L. Kitchen
- Applicant: CORNING INCORPORATED
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent Payal A. Patel
- Main IPC: F21V7/04
- IPC: F21V7/04 ; F21V8/00 ; H01L33/62 ; H01L33/48 ; H01L25/075 ; A61L2/10 ; A61L2/08 ; A61L2/26 ; H05K1/18

Abstract:
According to one implementation an assembly is provided that facilitates a coupling of one or more light diffusing optical fibers to one or more light emitting diodes. According to one implementation the assembly includes a light emitting diode positioned inside a cavity of a frame that is equipped with means to directly or indirectly electrically couple the anode and cathode of the light emitting diode to a printed circuit board. A proximal end portion of the light diffusing optical fiber is supported inside a through opening of a lid positioned over a front side of the frame. The light diffusing optical fiber includes a core that is surround by a cladding. According to some implementations the proximal end of the light diffusing optical fiber is butt-coupled to the light emitting diode with there being no gap between the proximal end of the fiber and the light emitting side of the light emitting diode.
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