A micromirror and micromirror array may have a first stationary structure, and a mirror structure connected to a first pivoting structure that pivots the mirror structure relative to the first stationary structure about a first axis of rotation. A first comb drive pivots the mirror structure about the first axis of rotation. The first comb drive has a first portion attached to the stationary structure and a second portion attached to the mirror structure, the first portion being electrically isolated from the second portion. The micromirror or micromirror array may be mounted to a Through Silicon Via (TSV) wafer having electrical connections that extend between a first side and a second side of the TSV wafer such that the first and second portions of each comb drive are electrically connected to the electrical connections.