Invention Grant
- Patent Title: Bin packing in 3D printers
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Application No.: US16192762Application Date: 2018-11-15
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Publication No.: US10552095B1Publication Date: 2020-02-04
- Inventor: Colin M. Lawson , Michael C. Salmon , Carly M Fennell , Christopher W. Bellamy , Amy J. Vanden Eynde , Christopher M. Owen , Shamil N. Hargovan , Hsiao Ting Lin , Aron Tremble
- Applicant: Wiivv Wearables Company
- Applicant Address: CA Vancouver
- Assignee: Wiivv Wearables Inc.
- Current Assignee: Wiivv Wearables Inc.
- Current Assignee Address: CA Vancouver
- Agency: Perkins Coie LLP
- Agent Jordan M. Becker
- Main IPC: G05B19/402
- IPC: G05B19/402 ; G06F3/12 ; B33Y50/02 ; B33Y10/00 ; G05B19/4155 ; G05B19/4099 ; G06F17/50 ; G06F16/51 ; G05B15/02

Abstract:
Disclosed herein is a technique to efficiently pack a print volume of 3D printers having print jobs with a large number of objects. The technique positions unique objects that adhere to a similar structural pattern more closely when the degree of variation between the objects is small. Thus, while each object is unique, a greater extent of similarity between the objects causes a given group of objects to be positioned more closely to one another in the print area of the 3D printer.
Information query
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