Invention Grant
- Patent Title: Semiconductor memory device
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Application No.: US15905350Application Date: 2018-02-26
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Publication No.: US10553276B2Publication Date: 2020-02-04
- Inventor: Rieko Funatsuki
- Applicant: Toshiba Memory Corporation
- Applicant Address: JP Tokyo
- Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kim & Stewart LLP
- Priority: JP2017-164770 20170829
- Main IPC: G06F3/06
- IPC: G06F3/06 ; G11C13/00

Abstract:
A semiconductor memory device includes a memory cell array, a first data latch that retains a write unit of data to be written to the memory cell array, a first address latch that retains a write address indicating a write target destination for the write unit of data in the first data latch, a second data latch that retains fail data that is a write unit of data that has failed to be written to the memory cell array, and a second address latch that retains a fail address indicating a write target destination for the fail data. A controller is configured to output the fail address from the second address latch in response to a first output command requesting output of the fail address and to output the fail data from the second data latch in response to a second output command requesting an output of the fail data.
Public/Granted literature
- US20190066782A1 SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2019-02-28
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