Invention Grant
- Patent Title: Method of manufacturing coil device
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Application No.: US15285605Application Date: 2016-10-05
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Publication No.: US10553344B2Publication Date: 2020-02-04
- Inventor: Han Kim , Kang Heon Hur , Sang Jong Lee , Jung Wook Seo
- Applicant: WITS Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: WITS Co., Ltd.
- Current Assignee: WITS Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2016-0033199 20160321
- Main IPC: H01F7/06
- IPC: H01F7/06 ; H01F27/28 ; H01F41/04 ; H01F38/14
Abstract:
A method of manufacturing a coil device and the coil device includes a base layer and a coil pattern formed on a surface of the base layer. The method of manufacturing a coil device includes forming a seed layer of a coil by bonding a copper foil to a base layer, etching to remove a portion of the copper foil, and plating a plating layer on the seed layer.
Public/Granted literature
- US20170271071A1 METHOD OF MANUFACTURING COIL DEVICE AND COIL DEVICE Public/Granted day:2017-09-21
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