Invention Grant
- Patent Title: Multilayer capacitor, method of manufacturing the same, and board having the same
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Application No.: US16018815Application Date: 2018-06-26
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Publication No.: US10553361B2Publication Date: 2020-02-04
- Inventor: Soo Hwan Son , Young Ghyu Ahn , Ho Yoon Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2017-0178054 20171222
- Main IPC: H01G4/012
- IPC: H01G4/012 ; H01G4/232 ; H01G4/248 ; H01G4/30 ; H05K1/11 ; H05K1/18 ; H01G4/12

Abstract:
A multilayer capacitor includes: a capacitor body including an active region including a plurality of first and second internal electrodes alternately exposed, respectively, through opposite end surfaces of the capacitor body in a length direction, and upper and lower cover regions disposed on upper and lower surfaces of the active region, respectively; and first and second external electrodes formed on the opposite end surfaces of the capacitor body in the length direction, respectively. The lower cover region of the capacitor body may have a space portion.
Public/Granted literature
- US20190198248A1 MULTILAYER CAPACITOR, METHOD OF MANUFACTURING THE SAME, AND BOARD HAVING THE SAME Public/Granted day:2019-06-27
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