Invention Grant
- Patent Title: Chip fuse and method for producing same
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Application No.: US15311238Application Date: 2015-04-28
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Publication No.: US10553385B2Publication Date: 2020-02-04
- Inventor: Koji Nakanishi , Satoshi Nishimura
- Applicant: KAMAYA ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: Kamaya Electric Co., Ltd.
- Current Assignee: Kamaya Electric Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agent Jason D. Voight
- Priority: JP2014-102171 20140516
- International Application: PCT/JP2015/062793 WO 20150428
- International Announcement: WO2015/174270 WO 20151119
- Main IPC: H01H85/17
- IPC: H01H85/17 ; H01H85/041 ; H01H85/08 ; H01H69/02 ; H01H85/157

Abstract:
Provided is a chip fuse and a method for producing the same, which is improved to facilitate balanced release of impact and vapor generated upon fusion. The chip fuse includes a fuse body having a pair of facing upper and lower ceramic substrates, a fuse wire support having a vertical through hole in its center and held between the ceramic substrates, and a fuse wire mounted between the two ends of the fuse wire support across the through hole, and a pair of metal caps fitted on the two ends of the fuse body, wherein the upper ceramic substrate and the fuse wire support, and the lower ceramic substrate and the fuse wire support, are respectively adhered together on their mutually facing surfaces to hermetically close the through hole, partially leaving a non-adhered region on the adhered surfaces.
Public/Granted literature
- US20170084415A1 CHIP FUSE AND METHOD FOR PRODUCING SAME Public/Granted day:2017-03-23
Information query
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