Invention Grant
- Patent Title: Supporting member and substrate processing apparatus
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Application No.: US14326614Application Date: 2014-07-09
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Publication No.: US10553408B2Publication Date: 2020-02-04
- Inventor: Akihiro Yoshimura , Takashi Kitazawa , Yasushi Masuda
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP2013-146571 20130712
- Main IPC: H01J37/32
- IPC: H01J37/32
Abstract:
A supporting member is configured to support at least one pipe connecting a temperature adjusting unit with a substrate processing apparatus, wherein the temperature adjusting unit adjusts a temperature of an arbitrary component of the substrate processing apparatus, wherein an inside of the supporting member includes a hollow portion and the at least one pipe is arranged in the hollow portion.
Public/Granted literature
- US20150013938A1 SUPPORTING MEMBER AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2015-01-15
Information query
