Invention Grant
- Patent Title: Method and device for polishing semiconductor wafer
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Application No.: US14912426Application Date: 2014-05-29
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Publication No.: US10553420B2Publication Date: 2020-02-04
- Inventor: Kenji Yamashita
- Applicant: SUMCO TECHXIV CORPORATION
- Applicant Address: JP Nagasaki
- Assignee: SUMCO TECHXIV CORPORATION
- Current Assignee: SUMCO TECHXIV CORPORATION
- Current Assignee Address: JP Nagasaki
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2013-176825 20130828
- International Application: PCT/JP2014/064252 WO 20140529
- International Announcement: WO2015/029524 WO 20150305
- Main IPC: H01L21/02
- IPC: H01L21/02 ; B24B37/005 ; B24B37/34 ; H01L21/67 ; H01L21/66
Abstract:
A method includes: polishing a semiconductor wafer by a polishing device; measuring a form of the semiconductor wafer by a measuring device before a polished surface of the semiconductor wafer becomes hydrophilic; and setting polishing conditions for the polishing based on a measurement result of the form of the semiconductor wafer by a polishing condition setting unit.
Public/Granted literature
- US20160196966A1 METHOD AND DEVICE FOR POLISHING SEMICONDUCTOR WAFER Public/Granted day:2016-07-07
Information query
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