Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US16017735Application Date: 2018-06-25
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Publication No.: US10553451B2Publication Date: 2020-02-04
- Inventor: Dong Jin Kim , Jin Han Kim , Won Chul Do , Jae Hun Bae , Won Myoung Ki , Dong Hoon Han , Do Hyung Kim , Ji Hun Lee , Jun Hwan Park , Seung Nam Son , Hyun Cho , Curtis Zwenger
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Priority: KR10-2015-0037481 20150318
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/683 ; H01L23/538 ; H01L23/00 ; H01L23/498 ; H01L23/31 ; H01L21/56
Abstract:
A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.
Public/Granted literature
- US20180308712A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-10-25
Information query
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