Invention Grant
- Patent Title: Substrate storing method and substrate processing apparatus
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Application No.: US15213618Application Date: 2016-07-19
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Publication No.: US10553468B2Publication Date: 2020-02-04
- Inventor: Akira Itakura
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP2015-148146 20150727
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/673

Abstract:
A substrate processing apparatus includes a process module in which a substrate is processed, a first substrate storing container, a second substrate storing container, and a transferring module that conveys the substrate between locations connected by the transferring module, wherein the process module, the first substrate storing container, and the second substrate storing container are connected by the transferring module, the method including the successive steps of, conveying an unprocessed substrate stored in the first substrate storing container to the second substrate container, conveying the unprocessed substrate stored in the second substrate storing container to the process module to process the unprocessed substrate, conveying the processed substrate processed in the process module to the first substrate storing container, and introducing inactive gas into the first substrate storing container.
Public/Granted literature
- US20170032994A1 SUBSTRATE STORING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2017-02-02
Information query
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