Invention Grant
- Patent Title: Sealed substrate carriers and systems and methods for transporting substrates
-
Application No.: US15871855Application Date: 2018-01-15
-
Publication No.: US10553469B2Publication Date: 2020-02-04
- Inventor: Michael Robert Rice , Jeffrey C. Hudgens
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/673 ; B65D85/00
Abstract:
An electronic device manufacturing system is disclosed. The system includes a processing tool having one or more processing chambers each adapted to perform an electronic device manufacturing process on one or more substrates; a substrate carrier adapted to couple to the system and carry one or more substrates; and a component adapted to create a sealed environment relative to at least a portion of the substrate carrier and to substantially equalize the sealed environment with an environment within the substrate carrier. Methods of the invention are described as are numerous other aspects.
Public/Granted literature
- US20180138068A1 SEALED SUBSTRATE CARRIERS AND SYSTEMS AND METHODS FOR TRANSPORTING SUBSTRATES Public/Granted day:2018-05-17
Information query
IPC分类:
