Invention Grant
- Patent Title: Edge ring for a substrate processing chamber
-
Application No.: US14975119Application Date: 2015-12-18
-
Publication No.: US10553473B2Publication Date: 2020-02-04
- Inventor: Govinda Raj , Kadthala R. Narendrnath , Bopanna Ichettira Vasantha , Simon Yavelberg
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H01L21/67 ; C23C16/458 ; B33Y10/00 ; B33Y80/00

Abstract:
An edge ring and process for fabricating an edge ring are disclosed herein. In one embodiment, an edge ring includes an annular body and a plurality of thermal breaks disposed within the annular body. The thermal breaks are disposed perpendicular to a center line of the annular body of the edge ring.
Public/Granted literature
- US20160181142A1 EDGE RING FOR A SUBSTRATE PROCESSING CHAMBER Public/Granted day:2016-06-23
Information query
IPC分类: