Invention Grant
- Patent Title: Single layer integrated circuit package
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Application No.: US15476648Application Date: 2017-03-31
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Publication No.: US10553475B2Publication Date: 2020-02-04
- Inventor: Zalina Binti Abdullah , Roslan Bin Ahmad , Poh Cheng Ang , Poh Choon Whong , Hai San Tew , Shin Hung Hwang , Chee Can Lee , Tiyagarajan S/O Arumugham
- Applicant: QDOS Flexcircuits Sdn Bhd
- Applicant Address: MY Bayan Lepas
- Assignee: QDOS Flexcircuits Sdn Bhd
- Current Assignee: QDOS Flexcircuits Sdn Bhd
- Current Assignee Address: MY Bayan Lepas
- Agency: Smirman IP Law, PLLC
- Agent Preston Smirman
- Priority: MYPI2016701183 20160331
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/48 ; H01L21/768 ; H01L23/00 ; H01L21/70 ; H01L23/367 ; H01L23/13 ; H01L21/56
Abstract:
An integrated circuit packaging is described, including a plurality of electrical circuits developed using a first patterned conductive layer on a base, wherein an electrical circuit is formed by using a masking material, and an interconnection is developed between the electrical circuits, where the interconnection is disposed on at least one side of the first patterned conductive layer and masking material, in which the interconnection is enclosed with a second masking material to form the integrated circuit packaging.
Public/Granted literature
- US20170323826A1 SINGLE LAYER INTEGRATED CIRCUIT PACKAGE Public/Granted day:2017-11-09
Information query
IPC分类:
