Invention Grant
- Patent Title: Substrate strip including conductive plane around periphery of chip mounting regions and method of manufacturing semiconductor package using the same
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Application No.: US14972341Application Date: 2015-12-17
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Publication No.: US10553514B2Publication Date: 2020-02-04
- Inventor: Keung Beum Kim , Wonchul Lim , Dongsuk Kim , Yonghoon Kim
- Applicant: Keung Beum Kim , Wonchul Lim , Dongsuk Kim , Yonghoon Kim
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2014-0184869 20141219
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/48 ; H01L23/52 ; H01L23/31 ; H01L23/498

Abstract:
A substrate includes a substrate body including a plurality of chip mounting regions and a peripheral region surrounding the plurality of chip mounting regions, each of the chip mounting regions including a conductive plane. The substrate further includes a conductive support structure located in the peripheral region, first conductive lines connected between the conductive planes of adjacent chip mounting regions, and second conductive lines connected between the conductive support structure and the conductive planes of chip mounting regions located adjacent the peripheral region.
Public/Granted literature
- US20160181195A1 SUBSTRATE STRIP AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME Public/Granted day:2016-06-23
Information query
IPC分类: